摘要
为了解决微组装大面积基板粘接带来的诸多问题,开展了大面积基板焊膏共晶焊工艺研究。介绍了共晶载体、基板和焊料的选择依据。根据经验和相关理论确定了丝网印刷中所用刮刀和丝网等材料的要求,通过正交实验得到理想的离网距离、刮刀压入量、刮刀移动速度和丝网厚度等关键丝网印刷参数。通过不断测量和调整温度曲线,得到了合理的温度曲线,获得了良好的共晶效果。
In order to solve the problems caused by the large area substrate adhesive, the large area substrate eutectic process was studied. The choice basis of eutectic carrier, substrate and the solder are introduced. The materials used in screen printing, such as scraper, silk screen and so on were confirmed according to the experience and the related theory. The ideal key parameters of screen printing are acquired through orthogonal experiments. Reasonable temperature curve is obtained by continuously measuring and adjusting the temperature curve. Finally, the good eutectic effect is obtained.
作者
杨宗亮
张晨曦
YANG Zong-liang ZHANG Chen-xi(Hebei branch of China Communication System Co. Ltd., Shijiazhuang 050081, China The Second Research Institute of CETC, Taiyuan 030024, China)
出处
《电子工艺技术》
2016年第5期270-272,286,共4页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:61404119)
关键词
微组装
基板共晶
丝网印刷
共晶温度
Micro-assembly
Substrate eutectic
Screen printing
Temperature curve
