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铜基银镀层的导电性及摩擦磨损性能 被引量:23

Conductivity and Tribological Properties of Electroplated Silver Coating Based on Copper Substrate
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摘要 为了提高电接触材料的导电性能和摩擦学性能,通过电镀方法在铜基体上制备纯银镀层,用回路电阻测定仪测定材料的导电性,采用MFT-R4000高速往复摩擦磨损试验机对比铜基体和银镀层在不同润滑条件下的摩擦磨损性能。通过扫描电镜(SEM)观察磨斑表面形貌,采用X射线能谱分析仪(EDS)分析磨斑表面的元素组成。结果表明:铜基体上镀银能够提高材料的导电性,其接触电阻最小;脂润滑能够提高铜基体和银镀层的减摩抗磨性能,且银镀层在脂润滑条件下具有优异的摩擦学性能,这归因于银镀层与润滑脂形成的固体-脂复合润滑的减摩和抗磨作用。 In order to improve the conductivity and tribological properties of electrical contact materials,silver coating was prepared by electroplating on copper substrate.The electrical conductivity of coating was tested by circuit resistance tester,and the tribological property was evaluated by high speed reciprocating friction and wear tester,respectively.In addition,the scanning electron microscopy(SEM) and energy-dispersive Xray spectroscopy(EDS) were employed to analyze the wear surfaces and typical elements.Results showed thai the silver plating could improve the conductivity of the substrate material and obtain the lowest contact resistance.Lubricating greases could improve antifriction and wear resistance property,and the silver coating under lubrication conditions had the best tribological performance,owing to the antifriction and wear influence of solid film/grease composite lubrication.
出处 《材料保护》 CAS CSCD 北大核心 2016年第10期1-4,13,共5页 Materials Protection
关键词 银镀层 铜基体 减摩抗磨性 接触电阻 固体-脂复合润滑 electroplated silver coating copper substrate antifriction and wear resistance contact resistance solid film/grease composite lubrication
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