摘要
目前业内对阻焊性能的探讨主要集中在硬度、耐溶剂和热冲击测试等方面，较少去定量分析阻焊的光、热固化程度对其性能的影响。阻焊光固化过程是在UV光曝光条件下，油墨成分中活性丙烯基团发生反应，热固化过程是在终固化高温下环氧基团发生反应。文章通过使用傅里叶红外光谱（FTIR）表征丙烯基团和环氧基团的反应程度，定量分析光热固化程度对阻焊附着力的影响，从而为改善阻焊掉油提供参考。
The discussion of sold mask is mainly focusing on the hardness, solvent resistance, thermal shock test and. so on in the industry, but not on the quantitative analysis with light and heat curing degree effect on. The light curing process is that the acroleic groups in the ink set off a chemical reaction under UV light. And the heat curing process is that epoxy groups set off a chemical reaction under final curing with high temperature. This thesis will give helpful advice to avoid the sold mask ink loss by observing the reaction degree of acroleic groups and epoxy groups with FTIR, to analyze the bonding force that light curing and heat curing give to.
出处
《印制电路信息》
2016年第A02期71-77,共7页
Printed Circuit Information
关键词
阻焊
固化程度
结合力
Solder Mask
Curing Degree
Bonding Force
