摘要
介绍了电源芯片的多Site测试设计与实现。基于CTA8280测试系统,通过对芯片CP(晶圆测试)要求进行分析,设计了8 Site测试电路外围,能够实现对晶圆进行8 Die并行测试。测试结果显示,该方案能够有效提升该电源芯片的测试效率,降低测试成本。
The paper introduces a design and implementation of Multi-Site test for power chip. By analyzing the CTA8280 test system and CP （wafer test） requirements, the 8 Site test peripheral circuit is designed for 8 Die parallel test. The results show that the proposed scheme effectively improves the test efficiency and reduce the cost.
出处
《电子与封装》
2016年第11期14-17,26,共5页
Electronics & Packaging
