摘要
功率模块芯片级焊接主要使用的是高温铅锡合金焊料,便于芯片进行二次模块封装,而焊接过程中的空洞是一个关键性的问题。通过高温锡铅合金焊料引入Ag元素,针对不同Ag元素组分下锡铅银合金焊片对焊接层空洞的影响进行了深入研究。实验表明采用高温焊料Pb92.5Sn5Ag2.5,焊接层具有较低的空洞率,高达98%以上的焊透率。
The solder Mainly used for power modules＇ chip welding is tin-lead solder at a high temperature,facilitating chips for the second modules＇ encapsulation,and the hole in the welding process is a key problem.Tin-lead solder at a high temperature joins Ag elements,the influence of welding hollow has conducted the thorough research under different Ag element components for tin-lead-silver alloy solder piece. The experimental results in this paper show that welding layer has lower void content by using high temperature solder Pb92.5Sn5Ag2.5 and optimal welding process,welding penetration rate is more than 98%.
出处
《装备制造技术》
2016年第12期81-84,共4页
Equipment Manufacturing Technology
关键词
铅锡合金
空洞率
焊接
tin-lead solder
void rate
welding
