摘要
以不同二官能度和三官能度的有机烷氧基硅烷作为单体,采用无溶剂法脱水缩合共聚得到高折光指数的苯基乙烯基有机硅树脂,通过含氢硅油交联剂硅氢加成固化有机硅树脂得到灌封材料。采用红外光谱、核磁共振、热重分析、紫外光谱、硬度仪、万能拉力机等方法对有机硅树脂和固化灌封材料进行表征,考察了不同因素对合成的影响,提出了封端剂后加入的工艺并对其加入时间进行了探究,最后研究了固化灌封材料的光学和力学性能,结果表明:用无溶剂法制备有机硅树脂,合适的催化剂、加水量、反应温度才能保证产物的透明性;封端剂的加入时间在1~1.5h内所得产物分子量和分子量分布最为适宜;探讨随苯基含量的增加,材料的折光指数呈线性的增加,且苯基质量分数为30%~40%时,所得固化产物力学性能最佳。
Using different difunctional and trifunctional organoalkoxysilane as monomers,we obtained phenyl vinyl silicone resin with high refractive index by solvent-free dehydration condensation copolymerization, and then prepared potting material by curing the silicone resin through hydrosilylation with silicone oil as crosslinking agent. IR,NMR,TGA,UV,hardness tester,universal testing machine and other methods were used to characterize the silicone resin and the cured potting material. Influences of different factors on the synthesis process were investigated and the optical and mechanical properties of the cured potting material were studied. The results showed that the preparation of solvent-free silicone resin required an appropriate catalyst,suitable amount of water and reaction temperature in order to ensure the transparency of the product. The refractive index of the material increased linearly with phenyl content,and the cured product showed the best mechanical properties when the phenyl content was 30% to 40%.
出处
《化工进展》
EI
CAS
CSCD
北大核心
2017年第2期634-640,共7页
Chemical Industry and Engineering Progress
基金
江门市社会公益创新平台建设项目(江财工[2016]143号)
关键词
电子材料
LED封装
有机硅树脂
灌封材料
高折光指数
electronic materials
LED packaging
silicone resin
packaging material
high refractive index
