摘要
Sn基钎料是常用的低温钎料。为深入研究真空钎焊下Sn与Al结合机理,分析不同加压环境下,不同尺寸母材氧化膜破碎情况。结果表明:小尺寸Al母材氧化膜得以破碎和去除,而大尺寸Al母材氧化膜基本无变化。当采用尺寸大小相当的母材,母材变形量基本一致,氧化膜彻底破碎和去除,露出新鲜的母材基体,与钎料Sn直接接触。温度达到300℃时,Sn钎料对母材产生溶解,形成良好的结合。
Sn-base filler metal is a common solder at low temperature. The process for brazing aluminum alloy using Sn-base filler metal has been more fully studied,but little is known about the mechanism behind Sn/Al bonding under vacuum brazing. The current study looks at the damage occurring in the oxidation film of parent metals of different sizes when they are subjected to the different pressure environment. The study demonstrates that the oxidation film of small-sized Al parent metals can be damaged and removed,while the oxidation film of big-sized Al parent metals remains virtually unchanged; the application of the parent metal of similar sizes results in basically the same deformation in parent metal,leaving the oxidation film completely broken and removed in a way that exposes fresh parent metal base and produces a direct touch with brazing filler metal Sn. This is followed by raising the temperature to 300 ℃,under which Sn brazing filler metal dissolves the parent metal and gives a better combination.
作者
杨德云
石南辉
张健
郝亮
吴犇
Yang Deyun Shi Nanhui Zhang Jian Hao Liang Wu Ben(Faculty of Materials Engineering, Harbin Huade University, Harbin 150025, China School of Materials Science ＆ Engineering, Harbin Institute of Technology, Harbin 150001, China)
出处
《黑龙江科技大学学报》
CAS
2016年第5期546-551,共6页
Journal of Heilongjiang University of Science And Technology
基金
黑龙江省教育厅科学技术研究项目(12543034)
关键词
锡钎料
纯铝
钎焊工艺
氧化膜
Tin solder
aluminum
brazing process
oxidation film
