摘要
采用镀层铜为中间层,在温度为600,650,700,750和800℃,保温时间45 min,焊接压力15 MPa下对Cu-0.15Zr/GH3030进行真空扩散焊,并对接头组织性能分析.结果表明,温度升高使扩散区变宽,孔隙减少.700℃时,组织以α固溶体、Ni/Al的富铬碳化物相为主,且分布均匀.750℃时,析出强化相增多,但出现孔洞,Cu-0.15Zr软化严重,接头变形量大.温度过低或过高,拉伸试样均在Cu-0.15Zr侧断裂.断口韧窝为非等轴状,Cu-0.15Zr侧现蛇形滑移线,两侧韧窝底部均有第二相,断裂类型为沿晶韧性断裂.综合焊合率、变形量、力学性能得保温时间45 min,焊接压力15 MPa,焊接温度700℃为最佳参数.
In this paper,Cu was applied as the interlayer,the Cu-0. 15 Zr was joined to GH3030 with vacuum diffusion bonding method at the temperature of 600℃,650℃,700℃,750℃ and 800℃ for 45 min under 15 MPa axial pressure. The microstructure and property of the joints bonded at different conditions were tested. The results showed that the width of diffusion zone was increased and the number of holes in diffusion zone reduced with the increase of the welding temperature. The α-Cu phases,rich Cr,Ni,Al carbide phases were uniform distribution in the interface. At 750℃,the number of strengthening phases increased,but many Kirkendall voids appeared,in addition,serious softened Cu-0. 15 Zr caused a big deformation of the joint.The tensile samples were fracture in Cu-0. 15 Zr side when temperature was too low or too high. The dimples were non-equiaxed and the snake slip line was apperaed in dimple wall at Cu-0. 15 Zr side. The second phases were present on both sides in the bottom of the dimples. The fracture type was intergranular ductile fracture. By considering the bonding rate,deformation and mechanical properties,it concluded that under the condition of 45 min and 15 MPa,700℃ was the best welding temperature parameter.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2017年第1期125-128,共4页
Transactions of The China Welding Institution
关键词
真空扩散焊
中间层
组织性能
韧性断裂
vacuum diffusion
interlayer
microstructure and properties
ductile fracture
