摘要
集成电路封装过程中,会产生各类污染物,包括氟、镍、光刻胶、环氧树脂和氧化物等,其存在会降低产品质量。微波等离子清洗技术作为一种精密干法清洗技术,可以有效去除这些污染物,改善材料表面性能,增加材料表面能量。本文介绍了微波频等离子清洗原理、设备及其应用,并对清洗前后的效果做了对比。
Integrated circuit package process can produce all kinds of contamination,which includes Fluorine、nickel、resist、Epoxy resin and oxid and so on..This can reduce quality. As an exact dry cleaning technology,microwave plasma cleaning could efficiently remove this contamination and improve material surface properties and increase material surface energy. This article introduces microwave plasma cleaning theory and equipment,and compares the effect after cleaning with it before.
出处
《国防制造技术》
2012年第3期40-42,共3页
Defense Manufacturing Technology
