摘要
为了实现高效率、高质量地加工硅片,提出一种超声椭圆振动辅助固结磨粒化学机械复合研磨硅片的新方法。首先简要介绍该方法所用装置及其工作原理,通过对研磨硅片的运动分析,建立其运动轨迹坐标系的数学模型并进行计算,然后借助MATLAB软件对研磨轨迹形状及其密度分布进行了仿真研究,其方法和结论可有效的为今后实验研究提供可供参考的理论依据。
In order to achieve high efficiency,high quality processing of silicon,puts forward a kind of ultrasonic elliptic vibration assisted consolidation of abrasive chemical mechanical grinding compound newmethod for silicon wafers First briefly introduce the method used device and its working principle,through analyzing the movement of grinding wafers,establish its mathematical model of the trajectory coordinates calculated,and then with the help of MATLAB software,simulation research on the shape and density distribution of the lapping tracks,its methods and conclusions can effectively provide reference theory basis for the experimental research in the future.
作者
刘曼利
侯军峰
杨卫平
LIU Man-li HOU Jun-feng YANG Wei-ping(College of Engineering, Jiangxi Agricultural University, Nanchang 330045, Chin)
出处
《组合机床与自动化加工技术》
北大核心
2016年第10期4-7,共4页
Modular Machine Tool & Automatic Manufacturing Technique
基金
国家自然科学基金(51065011)
国家留学基金委
江西省研究生创新专项资金项目(YC2013-S127)
关键词
超声椭圆振动
化学机械
研磨
轨迹仿真
硅片
ultrasonic elliptical vibration
chemical mechanical
grinding
silicon wafer
trajectory simulation
