摘要
以聚酯多元醇、聚醚多元醇、异氰酸酯等为主要原料制备理论湿固化聚氨酯热熔(PUR),对其结构进行了红外光谱表征;相对分子质量及分布通过GPC法测定;热性能特性进行TGA-DSC表征;分析其对不同材料的粘结性能及老化性能。结果表明,制备的PUR热熔胶各项结构性能与汉高PUR-3542类似,各项物理性能、对不同基材的粘结强度及老化性能都良好,可取代汉高3542的PUR热熔胶用于电子行业。
A reactive polyurethane hot melt adhesive was prepared with polyester polyol/polyether polyol, isocyanate mixture as main raw materials.The structure of HMPUR was characterized by infrared spectrum （IR）. The relative molecular weight and distribution was measured by the method of Gel Permeation Chromatography （GPC）.The thermal properties was analysed by themogravimetry （TGA） and differential thermal analysis （DSC）. The research results showed that the adhesive had excellent bonding properties for different substrate, such as PC, ABS, metal. And the aging performance was good. The comprehensive properties were similar to Henke 3542. The prepared HMPUR can be used to replace Henkel 3542 for electronic industry. Keywords： hot melt polyurethane adhesive; reactive; bond strength
出处
《广东化工》
CAS
2017年第11期82-83,79,共3页
Guangdong Chemical Industry
关键词
聚氨酯热熔胶
湿固化
粘结强度
hot melt polyurethane adhesive
reactive
bond stzength
