摘要
随着微电子机械系统(MEMS)消费市场的不断增长,微器件的可靠性问题将是未来数年MEMS研究面临的新挑战。针对国内外近年来在微机械失效方面的主要研究内容,综述了基于MEMS工艺微机械的主要失效形式、失效机理和失效预防措施的最新研究成果和主要研究方法,着重总结了微机械的断裂、疲劳、磨损、黏附和蠕变等失效形式,并分析了这些失效形式对微器件的功能和性能的影响以及对这些失效的预防措施,通过结构优化、器件设计和加工质量控制等措施可降低失效的发生,提高可靠性。最后总结了微机械失效分析中存在的主要问题和以后的发展方向,提出建立通用的失效预测模型、标准的可靠性测试方法是未来微机械失效分析的研究重点。
Reliability for micro-electromechanical system（ MEMS） device is identified as the next challenge for the forthcoming years due to its growing consumption market. Aiming at the main research contents of the micromechanical failure in recent years at home and abroad,the latest research results and main research methods of the main failure modes,failure mechanism and failure prevention measures based on the MEMS process micromachine are reviewed. The failure modes including micro-mechanical fracture,fatigue,wear,stiction and creep are emphatically summarized. The effects of the failure modes on the functionality and performance of the microdevices and the prevention measures of the failures are analyzed. It is concluded that through the measures of structural optimization,device design and processing quality control,the occurrence of failure can be reduced and the reliability can be improved. Finally,the main problems of micromechanical failure analysis and the development direction in the future are summarized. It is proposed that the establishment of a universal failure prediction model and standard reliability test method will be the research hotspot of micromechanical failure analysis in the future.
出处
《半导体技术》
CSCD
北大核心
2017年第7期481-488,共8页
Semiconductor Technology
基金
甘肃省自然科学基金资助项目(145RJZA085)
兰州城市学院博士科研启动基金资助项目(LZCU-BS2015-05)
