摘要
介绍了铜基化学镀锡工艺技术及其特点,详细分析了铜基上化学镀锡中还原剂、促进剂、络合剂、防氧化剂等各种化学药剂作用。
the technology and characteristics of electroless tin plating on copper substrate are introduced. The effects of various chemical agents such as reducing agent, accelerator, complexing agent and anti oxidant on electroless tin plating on copper substrate are analyzed in detail.
出处
《云南化工》
CAS
2017年第6期76-78,共3页
Yunnan Chemical Technology
关键词
镀锡
铜基镀锡
化学镀锡
tin plating
copper based tin plating
electroless tin plating
