摘要
以某中频接收模块为研究对象,首先分析了PCB板和FPGA芯片的建模方法,并在ANSYS Icepak软件中进行仿真。通过仿真计算,明确了所选模块的温度分布,结果发现设计的导热盖板有效降低了各热源表面的温度。然后将仿真结果和实测温度进行对比,验证了仿真模型的有效性。最后对导热盖板做了改进设计,为模块的结构设计提供了理论依据。
It analyzes reasonable models for PCBs and all kinds of FPGA chips,simulates the intermediate-frequency receiver module in ANSYS Icepak software. Based on the temperature distribution of the selected module,it designs the initial cover plate effectively and reduces the surface temperature of each source. It measures the surface temperature of the heat source and verifies the effectiveness of the simulation model. In order to enhance the cooling capacity of this module,it improves the structure and compares with the initial one. The results provide theoretical guidance for the structure design of the module.
出处
《机械设计与制造工程》
2017年第7期77-81,共5页
Machine Design and Manufacturing Engineering
关键词
板级热分析
合理模型
热源温度
结构改进
thermal analysis at PCB level
reasonable model
heat resource temperature
improving structure
