摘要
为了优化高压隔离开关导电回路温升与电磁场,本文利用Solidworks建立三维模型与ANSYS workbench进行仿真分析,以GW5隔离开关的导电回路为对象进行电磁场与温度场仿真分析与性能优化。首先通过仿真计算得到最大电磁场强度与最大温升出现在触指结构上。其次,通过改变触指的材料以及结构,不断地将结果进行对比和分析,得到了钨铜可以降低触指的温升程度到23.032℃,触指的全倒圆角可以降低触指结构的最大电磁场强度。本文提出的性能优化方案以及计算结果,可以为今后的高压隔离开关设计方案提供理论依据。
In order to optimize the temperature rise and electromagnetic field of the conductive circuit of the high disconnector, Solidworks is used to establish three-dimensional model and ANSYS workbench is used to simulation analysis. The simulation analysis and performance optimization of the conductive circuit of the GW5 type disconnector was performed based on the electromagnetic field and temperature field. The maximum electromagnetic field strength and the maximum temperature rise appears in the contact finger structure are obtained by simulation calculation. Tungsten copper can greatly reduce the temperature rise to 23.032℃ and chamfered of the all ends can greatly reduce the maximum electromagnetic field strength of the contact finger structure are summed up by changing the material and structure of the contact finger. The performance optimization scheme proposed and the calculation results in this paper could provide theoretical basis for the design of high voltage disconnector in the future.
作者
黄明亮
兰生
Huang Mingliang Lan Sheng(College of Electrical Engineering and Automation, Fuzhou University, Fuzhou 35000)
出处
《电气技术》
2017年第7期5-10,共6页
Electrical Engineering
关键词
隔离开关
电磁场
温度场
性能优化
有限元分析
disconnector
electromagnetic field
temperature field
performance optimization
finiteelement analysis
