摘要
本文主要针对电子元器件用导热绝缘材料的导热能力差而影响元器件工作效率与使用寿命的情况,详细介绍了导热填料、聚合物基体以及两者间的界面处理对绝缘材料导热性能的影响,综述了高导热绝缘材料在相关领域的应用状况,最后指出了填充型高导热绝缘材料在研究中存在的问题,并对其今后的研究方向进行了展望。
The work efficiency and service life of electronic components is affected by the poor thermal conductivity of thermal conductive and insulating materials. Aiming at this situation, the effects of ther- mal conductive fillers, polymer ＇matrix, and the interface treatment between them on the thermal conduct- ing properties of insulating materials were introduced in this paper. The application status of filled type high thermal conductive insulating materials in related fields was summarized. Finally, the problems in this research were pointed out, and the research direction was also proposed.
出处
《绝缘材料》
CAS
北大核心
2017年第8期29-33,共5页
Insulating Materials
关键词
填充型
高导热
绝缘材料
filled type
high thermal conductive
insulating materials
