摘要
应用红外热成像技术,对PCB板芯片组布局优化前后的表面温度进行试验测定,同时利用ICEPAK对PCB板表面温度场进行数值模拟,探索预测芯片组热布局效果的可行途径。试验结果表明布局优化后芯片组表面最高温度较随机布局从151.43℃降低至141℃,降幅为6.89%,布局优化降温效果明显。数值仿真发现PCB板导热系数、发射率、建模方式等因素对结果的准确性影响程度不同:发射率总体影响较小,而导热系数的影响较为显著,建模时应尽量减少对元件结构的简化。采用改进后的仿真模型对芯片组布局进行计算,结果显示芯片温度计算值相对误差最小为0.33%,最大为5.99%,布局优化前后最高温度降低5.61%。仿真值与实验结果符合较好,说明合理运用数值模拟技术可以替代实验对电子元件进行热布局分析。
Experiment was performed using infrared （IR）technology for measuring the temperature of a multi-chip PCB before and after thermal layout optimization. Meanwhile, ICEPAK was employed to numerically simulate the temperature field of the PCB, aiming to acquire a feasible technique to successfully predict the effect of the thermal layout optimization. The experimental results show that through layout optimization, the maximum temperature of the chip set was reduced by 6.89%（from 151.43 ℃ to 141 ℃ ） ,indicating that the effect of the layout optimization was obvious. The simulation result proved that the thermal conductivity of the PCB board, the emissivity and the model construction method had different effects on the simulation accuracy. The effect of the emission rate was not apparent while the thermal conductivity affected the result significantly. Moreover, it was very necessary to minimize the simplification of component structures during model construction process. Applying the improved simulation model for calculation of chip set thermal layout, it was found that the minimum relative error of the calculated super- ficial temperatures was 0.33% and the maximum relative error was 5.99% respectively. In addition, the maximum temperature decreased by 5.61% after the layout optimization. As a conclusion, the consistency of the simulation result with the experiment indicates that the simulation technique can substitute for experimental work to perform thermal layout analysis of the electronic components.
出处
《电子器件》
CAS
北大核心
2017年第4期800-805,共6页
Chinese Journal of Electron Devices
基金
陕西省自然科学基金项目(2013JM7015)
中央高校基本科研项目(0009-2014G1221021)
