摘要
运用单纯形优化法对铜箔棕化处理的配方和工艺条件进行动态寻优,得到最优组合为:内层键合剂25~40 mL/L,浓硫酸55~60 mL/L,双氧水35~50 mL/L,温度30~45℃,时间50~60s。在最优条件下棕化处理的铜箔与树脂的剥离强度达0.74 kg/cm,经100个冷热冲击循环、6次高温浸锡和6次无铅回流焊后均无分层、爆板现象。棕化后的铜箔表面形成了微观均匀的蜂窝状孔隙结构,剥离时分层发生于有机铜氧化膜与铜基板的界面处。
The bath composition and process conditions of brown oxidation for copper foil were dynamically optimized by simplex optimization method as follows： inner bonding agent 25-40 mL/L, concentrated sulfuric acid 55-60 mL/L, hydrogen peroxide 35-50 mL/L, temperature 30-45 ℃, and time 40-60 s. The peeling strength of copper foil treated by brown oxidization under the optimal conditions to pre-preg is up to 0.74 kg/cm. There is no stratification and delamination on the brown oxidized copper foil after thermal shock cycling for 100 times, tin immersion at high temperature for 6 times, and lead-free reflow soldering for 6 times. The surface of brown oxidized copper foil features a microscopically uniform honeycombed and porous structure, and the stratification occurs at the interface between organic copper oxidation film and copper substrate when the brown oxidation film is peeled.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2017年第16期874-880,共7页
Electroplating & Finishing
基金
广东省"扬帆计划"先进印制电路关键技术研发及产业化项目(2015YT02D025)
汽车电子用高密度智能控制印制电路关键技术及产业化项目(2015B09091032)
关键词
印制电路板
铜箔
棕化
剥离强度
耐热性
单纯形优化
printed circuit board
copper foil
brown oxidation
peeling strength
thermal resistance
simplex optimization
