摘要
2017年"芯动西安"活动周启动仪式在西安隆重开幕,国家集成电路封测产业链技术创新战略联盟秘书长于燮康应邀做了题为《中国集成电路产业链的现状分析》的主旨报告。以他五十年的产业经历从设计、制造、封测、装备材料、区域布局、大基金、产业前景与产业发展路径等七个方面对我国集成电路产业现状进行了分析。
In 2017, ＂core Xi＇an＂ activity week opening ceremony was solemnly opened in Xi＇an. YU Xiekang, secretary general of National IC packaging and testing industry chain technology innovation strategic alliance, is invited to give a keynote report entitled the status of China integrated circuit industry. In his fifty years of industry experience, he analysised on the current situation of the integrated circuit industry in China from the seven aspects of design, manufacturing, packaging and testing equipment, materials, funds, regional distribution, industry prospect and industry development path.
出处
《集成电路应用》
2017年第9期11-14,共4页
Application of IC
关键词
中国集成电路
IC封测产业
区域布局
China＇s integrated circuit, IC packaging and testing industry, regional layout
