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多结太阳电池用键合技术 被引量:1

Wafer bonding applied to multi-junction solar cells
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摘要 介绍了使用键合技术制备高效多结太阳电池的方法,即在不同材料衬底依次外延生长晶格匹配子电池,再通过键合技术将二者集成至一起。着重介绍了多种实现子电池集成的键合技术,并分析了其技术特点。 Fabrication method of high-efficiency multi-junction solar cells applying wafer bonding technology wasintroduced. Lattice-matched sub-cells were grown on different material substrate by epitaxy, then the tandemsub-cells were combined through wafer bonding technology. Several different wafers bonding technology forrealization of sub-cells combination were emphatically introduced, the characteristics of these technology wasanalyzed as well.
出处 《电源技术》 CAS CSCD 北大核心 2017年第9期1315-1318,共4页 Chinese Journal of Power Sources
关键词 键合 多结太阳电池 晶格匹配 wafer bonding multi-junction solar cells lattice-matched
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