摘要
为了揭示SiCp/Al复合材料的切削机理,提高其切削加工性,建立了一种SiCp颗粒和Al基体分离的有限元仿真模型,使用有限元软件ABAQUS从微观角度研究切屑的形成过程、基体和颗粒的内部应力分布,分析了不同切深和切削速度条件下切削力的变化规律,为了验证有限元仿真模型的有效性,进行了车削实验。仿真和实验结果表明:由于Si C颗粒的存在产生大量的微裂纹以及孔洞,形成表面缺陷,且剪切区域微裂纹的扩展是产生切屑的重要因素;而实验获得的切削力变化及其波动与仿真结果一致,进一步验证了仿真模型的有效性,为实际加工的切削参数优化提供参考。
Based on the respective definition of SiC and A1, a finite element simulation model is established to improve the machinability and reveal the cutting mechanism of SiCp/A1 composites. Using software ABAQUS, the change of cutting forces is investigated under condition of the different cutting speed and cutting depth; the chip formation process and the distribution of internal field are analyzed. Finally, the finite element simulation results are verified by turning experiments. The results show that hard SiC particles existing in the microscopic model will cause Micro-cracks, cavities, and surface defects. Moreover, the expansion of Micro-crack is an important factor of chips＇ generation in shear regions. The change and fluctuations of cutting force are consistent with the simulation results, which verify the availability and optimize the cutting parameters in actual machining process.
出处
《机械设计与研究》
CSCD
北大核心
2017年第5期156-159,共4页
Machine Design And Research
基金
广西高等教育本科教学改革工程资助项目(2016JGB351)
