期刊文献+

基体偏压对反应共溅射TiN/Ni纳米复合膜力学性能的影响

Effect of Bias Voltage on Mechanical Properties of Reactive Magnetron Co-Sputtered TiN/Ni Nanocomposite Films
下载PDF
导出
摘要 以高纯Ti和Ni为靶材,在不同偏压下利用反应磁控共溅射法制备了TiN/Ni纳米复合膜,采用X射线衍射、纳米压痕和划痕试验研究了偏压对复合膜相结构和力学性能的影响.结果显示,反应共溅射TiN/Ni纳米复合膜由fcc-TiN和Ni组成,其择优取向与偏压有关.随负偏压增加,复合膜晶粒尺寸逐渐减小,硬度、弹性模量、H/E、H^3/E^2和膜基结合力则先增加后下降.在偏压为-80V时所沉积的复合膜具有最好的力学性能,其硬度为(19.2±0.4)GPa、弹性模量为(311.0±5.0)GPa、H/E为0.062、H^3/E^2为0.073GPa,膜基结合力为45N. BTiN/Ni nanocomposite films have been deposited under different bias voltage by reactive magnetron co-sputtering of Ti and Ni targets in N_2 gas atmosphere,and the influence of substrate bias voltage on the phase structure and mechanical properties was investigated by X-ray diffraction,nanoindenter and scratch tests.The TiN/Ni films are composed of fcc TiN and Ni,and their preferential orientations strongly depend on bias voltage.When the bias voltage increases,the grain sizes are reduced whereas H,E,H/E,H^3/E^2 and adhesion strength are first improved and then decreased.The highest values of H,E,H/E,H^3/E^2 and adhesion strength are all presented at-80 V,which are(19.2±0.4)GPa,(311.0±5.0)GPa,0.062,0.073 GPa and 45 N,respectively.
出处 《沈阳大学学报(自然科学版)》 CAS 2017年第6期431-434,共4页 Journal of Shenyang University:Natural Science
基金 国家自然科学基金资助项目(51171118) 辽宁省高等学校优秀人才支持计划(LR2013054)
关键词 TiN/Ni 纳米复合膜 反应磁控共溅射 负偏压 力学性能 TiN/Ni nanocomposite film reactive magnetron co-sputtering negative bias voltage mechanical property
  • 相关文献

参考文献1

二级参考文献14

  • 1杨文茂,刘艳文,徐禄祥,冷永祥,黄楠.溅射沉积技术的发展及其现状[J].真空科学与技术学报,2005,25(3):204-210. 被引量:46
  • 2Musil J, Vlcek J. A Perspective of Magnetron Sputtering in Surface Engineering [-J 1. Surface and Coatings Technology, 1999,112(1) : 162 - 169.
  • 3Subramanian B, Ashok K, Jayachandran M. Effect of Substrate Temperature on the Structural Properties of Magnetron Sputtered Titanium Nitride Thin Films with Brush Plated Nickel Interlayer on Mild Steel[J]. Applied Surface Science, 2008,255(5) :2133 - 2138.
  • 4Benegra M, Lamas D G, Ferndndez de Rapp M E, et al. Residual Stresses in Titanium Nitride Thin Films Deposited by Direct Current and Pulsed Direct Current Unbalanced Magnetron Sputtering[J]. Thin Solid Films, 2006,494(1) :146 - 150.
  • 5Polyakova I G, Htibert T. Thermal Stability of TiN Thin Films Investigated by DTG/DTA [J]. Surface and Coatings Technology, 2001,141 (1) : 55 - 61.
  • 6Patsalas P, Charitidis C, Logothetidis S. The Effect of Substrate Temperature and Biasing on the Mechanical Properties and Structure of Sputtered Titanium Nitride Thin Films[J]. Surface and Coatings Technology, 2000, 125(1) :335- 340.
  • 7Wang H, Zhang S, Li Y, et al. Bias Effect on Microstructure and Mechanical Properties of Magnetron Sputtered Nanocrystalline Titanium Carbide Thin Films [J]. Thin Solid Films, 2008,516(16) ..5419 - 5423.
  • 8Devia D M, Restrepo-Parra E, Arango P J, et al. TiA1N Coatings Deposited by Triode Magnetron Sputtering.Varying the Bias Voltage [J]. Applied Surface Science, 2011,257(14) : 6181 - 6185.
  • 9Gangopadhyay S, Acharya R, Chattopadhyay A K, et aL Effect of Substrate Bias Voltage on Structural and Mechanical Properties of Pulsed DC Magnetron Sputtered TiN - MoSxcomposite Coatings[J]. Vacuum, 2010, 84 (6):843-850.
  • 10Nam N D, Kim J G, Hwang W S. Effect o Bias Voltage on the Electrochemical Properties of TiN Coating for Polymer Electrolyte Membrane Fuel Cell[J]. Thin Solid Films, 2009,517(17) :4772 - 4776.

共引文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部