摘要
通过分析信号-地TSV物理结构,提出可扩展等效电路模型,并用数学表达式表示出电容电感等电学参数。然后用多物理场耦合三维仿真软件COMSOL Multiphysics仿真信号-地TSV三维模型,并将COMSOL Multiphysics软件仿真分析得到的插入损耗结果和数学模型得到的结果作比较,验证建立的等效电路模型的准确性。最后,分析信号-地TSV半径、高度与间距对其插入损耗的影响。结果表明,信号-地TSV互连结构的传输性能随着半径的增大变得越好,随着其间距和高度的增加而变得越差。
By analyzing the physical structure of signal-ground TSV,a scalable equivalent circuit model is put forward,and its electrical parameters such as capacitance and inductance are shown with mathematical expressions. The multi-physics coupling three-dimensional simulation software COMSOL Multiphysics is used to simulate the three-dimensional model of signal-ground TSV. The insertion loss obtained with COMSOL Multiphysics simulation analysis is compared with that obtained with mathematical model to verify the accuracy of the established equivalent circuit model. The influence of the signal-ground TSV′s radius,height and spacing on the insertion loss is analyzed. The results show that the transmission performance of the signal-ground TSV interconnect structure becomes better with the increase of the radius,and worse with the increase of the height and spacing.
出处
《现代电子技术》
北大核心
2017年第23期34-37,共4页
Modern Electronics Technique
基金
湖北省公安厅自主科研项目(hbst2014yycx03)
关键词
信号-地硅通孔
等效电路模型
插入损耗
信号传输
signal-ground TSV
equivalent circuit model
insertion loss
signal transmission
