摘要
为改善焦磷酸盐电镀Cu-Sn合金层的耐蚀性能差、镀速慢、结合力差等问题,用失重试验、形貌成分分析及电化学技术等方法,研究了阳极中Sn含量对焦磷酸盐电镀Cu-Sn合金层的沉积速率、腐蚀速率、腐蚀过程和微观形貌等的影响。结果表明:当阳极中Sn含量(质量分数)为25%时,Cu-Sn合金镀层的沉积速率较大[6.32mg/(cm2·h)],镀层中Sn含量为5.80%,属于低锡青铜,镀层耐蚀性好,在5%H2SO4溶液中的失重腐蚀速率最小,为0.011 8 mg/(cm2·h),腐蚀电流密度较小(84.7μA/cm2),腐蚀电位最正(-0.405 V),腐蚀倾向最小;CuSn合金镀层的包状物颗粒大小均匀、排列紧密、无明显的表面缺陷,镀层与基体结合良好。
In order to improve the corrosion resistance, poor deposition rate and binding force of the pyrophosphate electroplating Cu- Sn alloy coating, the influences of anode Sn content on the deposition rate, corrosion rate, corrosion process and microstructure of Cu - Sn alloy coating were investigated by weight loss test, SEM and electrochemical methods. Results showed that when Sn content in the Cu- Sn alloy anode was 25%,the high deposition rate （6.32 mg·cm-2 · [1-1） was obtained with low Sn content of 5.80%. The weight loss corrosion rate was low （0.011 8 mg·cm-2· h-1） in 5%H2S04 solution with the low corrosion current density （84.7μA/cm2） and high self-corrosion potential （-0.405 V） , and the Cu-Sn alloy coatings presented the best anti-corrosion property. In addition, alloy coating became dense, uniform and defect-free, and meantime the binding force was good.
出处
《材料保护》
CSCD
北大核心
2017年第11期66-68,77,共4页
Materials Protection
基金
四川省科技厅项目(2015JY0112)
过程分析与控制四川省高校重点实验室(2016005)资助
关键词
Cu-Sn合金镀层
焦磷酸盐镀液
阳极Sn含量
镀层性能
electroplating Cu-Sn alloy coating
pyrophosphate bath
Sn content of anode
coating properties
