摘要
为了提高氰酸酯/聚苯醚树脂体系的固化效率,采用二月桂酸二丁基锡固化催化剂,验证了其催化作用,并研究二月桂酸二丁基锡的用量对覆铜板力学性能、介电性能、吸水率和耐锡焊性的影响。结果表明:二月桂酸二丁基锡可以降低氰酸酯/聚苯醚树脂体系的表观活化能;随着二月桂酸二丁基锡用量的增加,体系的弯曲强度先上升后下降,在用量为2%时达到最大值;介电常数和介质损耗因数随着二月桂酸二丁基锡用量的增加先下降后上升,在用量为1%时达到最低值;吸水率随着二月桂酸二丁基锡用量的增加先下降后上升,在用量为2%时达到最低值;二月桂酸二丁基锡用量大于1%时会影响覆铜板的288℃耐焊锡性。加入适量的二月桂酸二丁基锡不仅可以提高基体树脂的固化效率,而且可以改善氰酸酯/聚苯醚树脂基覆铜板的韧性、介电性能、耐锡焊性,降低吸水率。
In order to improve the curing efficiency of cyanate estcr/polyphcnylene oxide resin （CE/PPO） system, dibutyl tin dilaurate （DBTDL） was used as catalyst and its catalytic ability was proved. The effects of DBTDL dosage on the mechanical properties, dielectric properties, water absorption rate, and soldering resistance of copper clad laminate （CCL） were studied. The results show that DBTDL can reduce the apparent activation energy of CE/PPO system; with the increase of DBTDL dosage, the bending strength of CE/PPO system increases at first and then decreases, reaches the maximum value when the dosage is 2%; the dielectric constant and dielectric loss factor of CE/PPO system decrease at first and then increase with the increase of DBTDL dosage, both reach the minimum values when the dosage is 1%; the water absorption rate of CE/PPO system decreases at first and then increases with the increase of DBTDL dosage, reaches the minimum value when the dosage is 2%; when the dosage of DBTDL is more than 1%, the soldering resistance of CCL at 288℃ is influenced. Adding proper amount of DBTDL improves the toughness, dielectric properties, and soldering resistance, while decreases the water absorption rate of CE/PPO based copper clad laminate.
出处
《绝缘材料》
CAS
北大核心
2018年第1期22-26,33,共6页
Insulating Materials
关键词
二月桂酸二丁基锡
力学性能
介电性能
吸水率
耐锡焊性
DBTDL
mechanical properties
dielectric properties
water absorption rate
soldering resistance
