摘要
随着以堆叠封装（POP）为代表的三维封装在各类便携式消费电子产品中的广泛应用,其面临的振动载荷日益增多,由振动失效而导致的电子产品的失效问题也日益突出。以两层堆叠POP模块为研究对象,采用两个不同的菊花链式电流回路来监测失效点,利用振动疲劳试验,结合有限元仿真和微观结构分析,研究了POP在振动载荷下的失效行为和疲劳特性,并对失效模式和失效机理进行了分析。研究结果表明,底部封装中最外排拐角处的焊点为振动载荷下POP的关键失效焊点,且焊点的失效模式为包含了脆性断裂（IMC层断裂）和韧性断裂（焊体破坏）的混合型断裂模式。
With the wide application of three-dimensional package represented by package-on-pa-ckage （POP） in various portable consumer electronics products, its vibration loading is increasing. And the failure of electronic products caused by the vibration failure is becoming more and more promi- nent. With two layers of stacked POP module as the research object, two different types of chrysanthe- mum chain current loops were used to monitor the failure point. The failure behavior and fatigue charac- teristics of the POP under the vibration loading were investigated with the finite element simulation, mi- crostructure analysis and vibration fatigue test. The research results indicate that the solder joint at the outermost corner of the bottom package is the critical failure solder joint for the POP under the vibration loading. And the failure mode of the solder joint is a mixed fracture mode containing brittle fracture （ IMC crack） and ductile fracture （bulk crack）.
出处
《半导体技术》
CAS
CSCD
北大核心
2018年第2期148-153,共6页
Semiconductor Technology
基金
广东省科技厅科技计划资助项目(2015B090906022,2016A040403038,2016A010104003,2014B040404046,2016B090923008,2016A040403035)
关键词
堆叠封装(POP)
振动可靠性
关键焊点
失效行为
失效模式
package-on-package （POP）
vibration reliability
critical solder joint
failure be- havior
failure mode
