摘要
比较了在相同的银含量条件下,银粉对薄膜电路用银浆导电性的影响;对比了微晶银粉分散剂、粒径及银粉片式化程度的对导电浆料导电性的影响;实验表明含有羧基的分散剂与银浆聚酯体系配合时浆料方阻低,随着粒径、片径增加并控制片厚的银粉可降低浆料方阻;
Silver powder effect on thin film circuit conductivity is investigated under same silver content. Silver powder surface modifier,particle size and flake thickness affect on paste conductivity. Experiment results indicate while modifier containing carboxyl functional group coordinate with poly ester resin well and result in low square resistance, increasing particle size and flake diameter with controlled flake thickness reduce square resistance as well.
出处
《世界有色金属》
2017年第22期243-244,共2页
World Nonferrous Metals
关键词
薄膜电路
导电银浆
导电性
聚酯树脂
thin film circuit
conductive silver paste
conductivity
Polyester resin
