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制袋机热封装置温度场模拟与优化设计 被引量:3

Temperature Field Simulation and Optimization Design of Heat Sealing Device for Bag Making Machine
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摘要 目的解决制袋机热封装置中烫刀热封表面温度差偏大的问题。方法用Solid Works软件对制袋机热封装置进行参数化建模,再调用Ansys Workbench插件进行稳态温度模拟仿真,分析其温度场的分布情况。然后通过增加电热管的数量来设计电热板的内部结构,对改进的模型进行有限元分析,并对电热板内电热管安装孔的长度进行优化设计。最后进行试验验证。结果将软件模拟结果与实测数据进行比较分析,两者基本吻合。基于有限元分析模拟的温度场的优化改进设计,可使热封装置的热封面温度差由原来的4.4℃降低至2.9℃。结论基于温度场模拟的电热板内部结构的改进设计可取得令人满意的热封面温差效果。 The work aims to solve the problem of larger temperature difference of the hot cutter's heat sealing surface in the heat sealing device for bag making machine. The parametric modeling of heat sealing device for bag making machine was established by Solidworks software. The steady state temperature was simulated by calling Ansys Workbench plug-in to analyze the distribution of its temperature field. Then, the internal structure of the electric heating plate was designed by increasing the number of the electric heating pipes. Finite element analysis of the improved model and the length optimization design of the mounting hole of electric heating pipe in the electric heating plate were carried out. Finally, the experimental verification thereof was conducted. The experimental results showed that the simulation results were in good agreement with the measured data. The optimization and improvement design of the temperature field simulated based on the finite element analysis could have the temperature difference of heat sealing surface of the heat sealing device reduced from 4.4 to 2.9 ℃ ℃. The improved design of the internal structure of electric heating plate simulated based on the temperature field can obtain satisfactory temperature difference effects of the heat sealing surface.
机构地区 南通大学
出处 《包装工程》 CAS 北大核心 2018年第3期178-182,共5页 Packaging Engineering
关键词 热封装置 制袋机 温度场 Workbench仿真 heat sealing device bag making machine temperature field Workbench simulation
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