摘要
以双酚F环氧树脂和丙烯酸为原料,经过聚合反应得到双酚F环氧丙烯酸酯预聚物,然后以二缩三丙二醇二丙烯酸酯（TPGDA）为稀释剂,安息香双甲醚（BDK）为光引发剂,按照m（双酚F环氧丙烯酸酯树脂）∶m（TPGDA）∶m（BDK）=70∶26∶4的比例配制成双酚F型光敏树脂,将光敏树脂的收缩率和凝胶含量作为指标考察了影响树脂性能的合成工艺。经过正交实验得到的最佳合成条件为：四甲基氯化铵为催化剂,用量为原料总质量的1.0%;对苯二酚为阻聚剂,用量为原料总质量的0.1%;反应温度为100℃;m（环氧树脂）∶m（丙烯酸）=1∶0.8;反应时间4 h。结果表明：最佳条件下得到的双酚F型光敏树脂收缩率为5.05%,凝胶含量（凝胶占固化树脂的质量分数,下同）为92.25%,相比于双酚A型环氧树脂收缩率降低约30%,凝胶含量增加约3%,对紫外光的灵敏性和吸收能力都相对增加,可以用于3D打印。
Bisphenol F epoxy acrylate prepolymer was prepared by using bisphenol F epoxy resin and acrylic acid as raw materials. When tri（ propylene glycol） diacrylate（ TPGDA） and benzil dimethyl ketal（ BDK） was used as diluent and photoinitator,bisphenol F epoxy acrylate prepolymer,TPGDA and BDK mass ratio of 70 ∶ 26 ∶ 4 were mixed to prepare photosensitive bisphenol F resin. The optimum synthesis process for photosensitive bisphenol F resin was evaluated by the shrinkage ratio and gel content. The orthogonal experiment results showed that tetramethyl ammonium chloride was used as catalyst hydroquinone as polymerization inhibitor,their dosage were 1. 0% and 0. 1% of the total mass of raw materials,respectively. Furthermore,when the mass ratio of epoxy resin to acrylic acid was 1∶0. 8 and the reaction was carried out at 100 ℃ for 4 h,the shrinkage ratio of photosensitive bisphenol F resin was5. 05% and the gel content was 92. 25%. Compared with that of bisphenol A type resin,the shrinkage ratio decreased by about 30% and the gel content increased by about 3%. Meanwhile,bisphenol F resin exhibited better both sensitivity and absorption capacity of UV light,thus it could be used in 3D printing.
出处
《精细化工》
EI
CAS
CSCD
北大核心
2018年第3期383-387,442,共6页
Fine Chemicals
基金
国家自然科学基金(21476172)~~
关键词
双酚F环氧树脂
双酚F环氧丙烯酸酯树脂
光敏树脂
3D打印
收缩率
凝胶含量
功能材料
bisphenol F epoxy resin
bisphenol F epoxy acrylate resin
photosensitive resin
3D printing
shrinkage ratio
gel content
functional materials
