摘要
研究了活化胶处理（烧结）温度对化学镀铜层的影响，并与常规活化处理的化学镀铜工艺作了对比。结果表明，经过400℃烧结的活化胶活化处理后的化学镀铜工艺优于常规活化处理的化学镀铜工艺。
The influence of activated adhesive treatment temperature （sintering） on the elcetroless copper plating processwas studied, which was compared with the chemical plating copper process after conventional activation. The results showthat electrocess copper plating using activated adhesive by sintering at 400 ℃ is better than that of the eleetrocess copperplating using conventional activation process.
作者
杨海鲸
朱晓云
龙晋明
曹梅
YANG Haijing, ZHU Xiaoyun, LONG Jinming, CAO Mei(School of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, Chin)
出处
《热加工工艺》
CSCD
北大核心
2018年第4期173-176,179,共5页
Hot Working Technology
关键词
化学镀铜
Al_2O_3陶瓷
活化工艺
活化胶
electroless copper plating
A1203 ceramics
activation process
activated adhesive
