摘要
微电子技术的不断进步使得电子信息系统朝着多功能化、小型化与低成本的方向全面发展。其中封装工艺正扮演着越来越重要的角色,直接影响着器件和集成电路的电、热、光和机械性能,决定着电子产品的大小、重量、应用方便性、寿命、性能和成本。针对集成电路领域先进封装技术的现状以及未来的发展趋势进行了概述,重点针对现有的先进封装技术,如晶圆级封装、2.5D和3D集成等先进封装技术进行了介绍。此外,还对封装技术未来的发展趋势进行了描述,主要针对三维高密度系统级封装(SiP)进行了介绍,这也是符合未来高性能低功耗的系统集成电子产品的重要技术方案。最后,还对目前国内先进封装行业进行了简要介绍。
The fast development of microelectronics technologies enables multi-functional, miniaturized and low cost electronic systems. Microelectronic packaging plays more and more important role, directly affects electrical, thermal, optical and mechanical performance of devices and integrated circuits, and determines the size, weight, application, lifetime, performance and cost of electronic products. This review summarizes the current status and future development of the advanced integrated circuit packaging technology, focusing on the current packaging techniques including wafer-level packaging, 2.5D and 3D integration technologies. In addition, the development trend in future packaging technology is also described with a focus on the 3D high-density system in package technology, which is one of the most significant approach to address the requirement by high-performance and low-power electronic devices in the future. Finally, the status of the advanced packaging development in China is also briefly introduced.
作者
周晓阳
ZHOU Xiaoyang(Amkor Technology Shanghai Co. Ltd, Shanghai 200131, China.)
出处
《集成电路应用》
2018年第6期1-7,共7页
Application of IC
基金
上海市经济和信息化委员会软件和集成电路产业发展专项基金(2016.160505)
关键词
集成电路
封装技术
SIP
integrated circuit
microelectronic packaging technology
SiP
