摘要
电子产品焊接后PCB板面出现"水渍"、残留不均匀等异常现象,通常我们认为是助焊剂的问题,但实践中,切换其它PCB有明显改善。本文研究了表面张力对此现象的影响分析,并通过实验验证,找出影响因素。
The abnormal conditions of water stains and residue on PCB surface after welding of electronic products usually are taken as the a problem of flux, but in the actual production process, switching other PCB has improved this phenomenon obviously. This paper studies the influence of surface tension on this phenomenon, and finds the solution through test verification.
出处
《日用电器》
2018年第6期80-82,共3页
ELECTRICAL APPLIANCES
