摘要
文中对某驱动控制器做了详细的散热设计。首先进行水冷板和流道初步设计,然后通过热仿真结果优化散热设计。同时对比了仿真和理论计算得到的IGBT结温,两种计算方法的误差小于2%。热仿真和理论计算结果均表明散热设计可以满足控制器在额定功率和峰值功率(60 s)两种工况下的要求。文中的计算和仿真结果可为驱动控制器产品的热设计和可靠性评估提供计算方法和参考数据。
A detailed thermal design for a drive controller is made in this paper. At first,the water cooling plate and the flow channel are designed preliminarily,and then the thermal design is optimized according to the thermal simulation results. At the same time,the IGBT junction temperatures obtained from simulation and theoretical calculation are compared,the difference between the two methods is less than 2%. Thermal simulation and theoretical calculation both show that the thermal design can meet the controller requirements under the conditions of rated power and peak power（ 60 s）. The simulation and calculation results of this paper are expected to provide calculation methods and reference data for the thermal design and the reliability assessment of drive controller products.
作者
王飞
吴刚
孔浩源
WANG Fei;WU Gang;KONG Hao-yuan(Shanghai Sigriner STEP Electric Co. Ltd. , Shanghai 201801, China)
出处
《电子机械工程》
2018年第3期48-51,共4页
Electro-Mechanical Engineering
关键词
驱动控制器
水冷
散热设计
IGBT结温
drive controller
water cooling
thermal design
IGBT junction temperature
