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基于贴片电阻焊点失效机理分析的高可靠贴装电阻器设计 被引量:1

Design of High Reliability Paste Resistor Based on Analysis of Failure Mechanism of Patch Resistance Solder Joint
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摘要 通过对贴片电阻焊点失效机理的分析,设计了一款高可靠精密贴装电阻器,解决了焊点失效带来的整机可靠性下降的问题,具备高精度、低温度系数、高机械强度、高耐湿等特性。可广泛应用于航天、航空、车载等高温差、高湿度、高机械应力等极端工况领域。 Through the analysis of the failure mechanism of the patch resistance solder joint, a high reliability and precision mounting resistor is designed to solve the problem of the reduction of the reliability of the whole machine. It has the characteristics of high precision, low temperature coefficient, high mechanical strength, high moisture resistance and so on.Thus, this kind of resistors could be widely used in the field of extreme conditions with high temperature difference, high humidity, high mechanical stress such as aerospace, aviation, vehicle etc.
作者 黄明怀 Huang Minghuai(Bengbu Double Ring Electronic Group Company Ltd.,Bengbu 233010,China)
出处 《安徽电子信息职业技术学院学报》 2018年第3期31-37,共7页 Journal of Anhui Vocational College of Electronics & Information Technology
关键词 贴片电阻 焊点 疲劳失效 热失配 SMD resistors solder joint stress fatigue thermal mismatch
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