摘要
在低熔点Sn2.5Ag0.7Cu0.1RE钎料合金粉末冶金制备工艺设计基础上,研究了预压和烧结对钎料合金组织与力学性能的影响。研究结果表明:低熔点Sn2.5Ag0.7Cu0.1RE钎料合金粉末冶金工艺预压应力和烧结温度分别为160 MPa和210℃,均高于高熔点铜、铝合金的预压应力和烧结温度。与熔炼法相比,Sn2.5Ag0.7Cu0.1RE钎料合金抗拉强度提高了15.5%。烧结会影响Sn2.5Ag0.7Cu0.1RE钎料合金初生β-Sn相和共晶组织形态,随烧结温度升高,初生β-Sn相组织比例升高。
Based on the powder metallurgy( PM) process design of low-melting Sn2. 5 Ag0. 7 Cu0. 1 RE alloy,the effects of compacting and sintering on the microstructure and mechanical properties of the solder alloy were studied. The results shows that the compacting stress and sintering temperature of low-melting Sn2. 5 Ag 0. 7 Cu0. 1 RE solder alloy are higher than that of copper and aluminum high-melting alloys. The preparation of Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy is achieved at the compacting stress 160 MPa and sintering temperature210 ℃ by PM. In addition,the tensile strength of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy increases by 15. 5%compared with the melting technology. The sintering has effects on themorphologies of the primary β-Sn phase and the eutectic structure of the Sn2. 5 Ag0. 7 Cu0. 1 RE solder alloy. The proportion of primary β-Sn phase increases with the increase of sintering temperature.
出处
《河南科技大学学报（自然科学版）》
CAS
北大核心
2018年第6期7-12,共6页
Journal of Henan University of Science And Technology:Natural Science
