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集成电路用Ti靶材和Cu62Zn38合金背板焊接技术研究 被引量:1

Research on diffusion bonding technology of Ti target and Cu62Zn38 alloy backplane for integrated circuit
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摘要 研究了高纯Ti和Cu62Zn38合金在不同的工艺条件下的扩散焊接性能和界面情况。结果表明,热等静压温度为510℃时,加工态Ti板硬度下降明显,与退火态Cu62Zn38接近;退火态Ti板和退火态Cu62Zn38两种材料硬度较为接近,而在温度接近525℃时,退火态Cu62Zn38合金硬度明显高于退火态Ti板。退火态Cu62Zn38合金与退火态高纯Ti经过焊接温度525℃,压力120 MPa,保温4 h的扩散焊接后,平均抗拉强度能达到136 MPa,焊接界面达到冶金结合,满足Ti靶材的使用要求。 The interracial condition and joint properties of diftusion bonded high-purity Ti and Cu62Zn38 alloy joint were studied under dift^rent welding condition. The results showed that hardness of Cu62Zn38 and Ti was about the same when the hot isostatic pressing temperature was 510 ℃. Hardness of annealled Cu62Zn38 was higher than annealled Ti when the temperature rises to 525 ℃. The average tensile strength of sample can reach 136 MPa with the diffusion bonding temperature of 525 ℃ and hot isostatic press 120 MPa lasting for 4 hour. The welding interface of sample achieves metallurgical bonding and the joint properties of the sample can meet the requirements of Ti target.
作者 陈明 董亭义 吕景波 于文军 吕保国 Chen Ming;Dong Tingyi;Lti Jingbo;Yu Wenjun;Lti Baoguo(Grikin Advanced Materials Co.,Ltd.,Beijing 102200,China;The High Purity Metal Sputtering Target Engineering Technology Research Center in Beijing,Beijing 102200,China;Trillion Metals Co.,Ltd.,Beijing 100088,China)
出处 《机械制造文摘(焊接分册)》 2018年第4期43-46,共4页 Welding Digest of Machinery Manufacturing
关键词 靶材 高纯Ti 扩散焊接 Cu62Zn38合金 target high purity titanium diffusion bonding Cu62Zn38 alloy
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