摘要
镀铜凹坑缺陷作为印制电路板行业的常见问题,一旦大面积发生会造成大量产品的报废。本文主要针对图形转移、图形电镀过程阐述了镀铜凹坑发生的原因,从工艺过程控制方面提出解决措施,降低镀铜凹坑缺陷发生的几率。
Copper Plating Pit defect is a common problem in the PCB manufacturing, if it largely occurs, lots of boards will be discarded. In this paper, it is mainly discussed the occurrence causes for copper plating pit defects on graphic transfer and graphic plating process, and research improvements from process control, to reduce the occurrence probability of copper plating pit defects.
作者
郭金金
晁伟辉
成立芳
Guo Jinjin;Chao Weihui;Cheng Lifang
出处
《印制电路信息》
2018年第9期19-23,共5页
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