摘要
随着精细导线印制板的增多,电镀板面均匀性对侧蚀的影响日益突出,尤其全板电镀影响巨大。文章针对我公司的具体情况,通过对整个电镀槽设备附件的布局进行调整优化,使板面均匀性达到最佳的状态。
With the increase of the refned-lead PCB,the infuence of electroplating surface uniformity on side erosion becomes more and more important,especially in the whole plate electroplating,According to the specifc situation of the company,this paper optimizes the layout of the whole electroplating tank equipment accessories to achieve the best uniformity of the plate surface.
作者
陈金文
汪忠林
何燕春
马亚伟
Chen Jinwen;Wang Zhonglin;He Yanchun;Ma Yawei
出处
《印制电路信息》
2018年第10期41-44,共4页
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