摘要
为研究紫外光固化导电胶的性能及固化机制,以银包铜粉、环氧丙烯酸树脂为原料制备固化胶,采用刮涂法将浆料涂覆到载玻片上,置于紫外光下固化获得导电涂层。对试样的微观结构、力学和电学性能进行表征,对固化体系的热行为及固化反应动力学机理进行了研究,并利用Kissinger和Grane模型计算固化反应的活化能和反应级数。研究结果表明:光辐射下导电胶层可快速固化;当填料含量为70wt%时,浆料达最低电阻率1.122mΩ·cm;填料含量75wt%时剪切值最大为57.4MPa;活性稀释剂含量为35wt%时,浆料具有最佳的固化速度和网联结构;固化反应过程中表观活化能为15.17kJ/mol,固化工艺为172.3℃→302.05℃→369.35℃,为一级固化反应;浆料在200℃以下具有较好的抗氧化性能。
In order to study the property and curing mechanism of UV cured adhesive,the adhesive was firstly prepared by mixing silver coated copper particles and epoxy acrylic resin with some chemical aid agents.The conductive coating was then obtained by painting the adhesive on a glass slide and cured with UV.The microstructure,mechanical and electrical properties were characterized in conventional methods.The thermal behavior of the curing system,the curing reaction kinetics and mechanism were also investigated.The activation energy and order of the curing reaction were analyzed and estimated by using the Kissinger and Grane model.Results show that：the conductive adhesive film can be cured quickly under UV radiation;when the filler content is 70 wt%the resistivity of the conductive adhesive reaches its minimum value,1.122 mΩ·cm,and when that is 75 wt%the shear value is 57.4 MPa,the maximum shear value.For the reactive diluent content is35 wt%,the slurry shows the largest curing speed and the best network structure.The apparent activation energy of the curing reaction is 15.17 KJ/mol.The curing reaction of the system was first grade reaction that the curing process is represented by 172.3℃→302.05℃→369.35℃.The conductive adhesive system shows a relatively high oxidation resistance below 200℃.
作者
边慧
苏晓磊
屈银虎
BIAN Hui;SU Xiaolei;QU Yinhu(College of Materials Engineering,Xi＇an Polytechnic University,Xi＇an 710048,China)
出处
《材料科学与工程学报》
CAS
CSCD
北大核心
2018年第3期438-442,518,共6页
Journal of Materials Science and Engineering
基金
西安工程大学研究生创新基金资助项目(CX201612)
西安工程大学机械工程学科建设资助项目
陕西省教育厅自然专项资助项目(15JK1314)
陕西省工业科技攻关资助项目(2013k09-33)
关键词
紫外光固化
导电胶
环氧丙烯酸树脂
固化动力学
银包铜粉
抗氧化性
UV curing
conductive adhesive
epoxy acrylate resin
curing kinetics
silver coated copper powder
oxidation resistance
