摘要
以组成(质量分数)为15%B_2O_3-45%MgO-35%SiO_2-5%ZrO_2(BMSZ)的玻璃粉体和AlN粉体为原料,采用常压烧结工艺制备了不同玻璃含量(55%~80%,质量分数,下同)的BMSZ玻璃-AlN陶瓷复合材料,研究了玻璃含量对复合材料烧结性能、热学性能、介电性能和力学性能的影响。结果表明:在AlN粉体中添加玻璃粉体后,在775~875℃烧结即可得到致密的复合材料;玻璃含量的适量增加能够促进烧结致密化,当玻璃含量超过70%后,其促进烧结致密的作用开始减弱,并会恶化复合材料的热导率与抗弯强度,但适当降低了复合材料的介电损耗;当玻璃含量为70%时,在825℃烧结所得复合材料的结构致密,综合性能最佳,体积密度为2.84g·cm^(-3),热导率为9.12W·m^(-1)·K^(-1),相对介电常数为7.65,介电损耗角正切为1.24×10^(-3),抗弯强度为174.88MPa。
With glass powder composed of 15 wt%B2 O3-45 wt%MgO-35 wt%SiO2-5 wt%ZrO2（BMSZ）and AlN powder as raw materials,BMSZ glass-AlN ceramic composites containing different glass content（55 wt%-80 wt%）were prepared by conventional pressureless sintering.The effects of glass content on the sintering performance,thermal properties,dielectric properties and mechanical properties were discussed.The results show that after adding the glass powder into the AlN powder and then being sintered at 775-875 ℃,the dense composites were obtained.Increasing the glass content properly improved the sintering densification.When the glass content exceeded 70 wt%,the addition of glass weakened its role to promote the sintering densification,and deteriorated the thermal conductivity and bending strength of the composite,but appropriately reduced the dielectric loss of the composite.When the glass content was 70 wt%,the composite sintered at 825 ℃ had a dense structure and obtained the best comprehensive performance,with the bulk density of 2.84 g·cm^-3,the relative thermal conductivity of 9.12 W·m^-1·K^-1,the dielectric constant of 7.65,the dielectric loss angle tangent of 1.24×10^-3,and the bending strength of 174.88 MPa.
作者
徐健丰
XU Jianfeng(Department of Special Equipment,Hangzhou Vocational Technology College,Hangzhou 310018,China)
出处
《机械工程材料》
CAS
CSCD
北大核心
2018年第10期46-50,76,共6页
Materials For Mechanical Engineering
关键词
ALN
硼硅酸盐玻璃
低温共烧基板
热导率
介电性能
抗弯强度
烧结性能
AlN
borosilicate glass
low temperature co-fired substrate
thermal conductivity
dielectric property
bending strength
sintering performance
