摘要
HDI板在智能手机、医疗电子、汽车电子等多个领域得到广泛应用，随着终端消费者对电子产品提出越来越多的需求，加之HDI在新型领域的应用逐步推广．这就对HDI制作技术、设备和HDI电路板使用的板材等提出了越来越高的要求。HDI印制电路对材料的高频高速、超薄化和稳定性等方面有了更多、更高的新要求．为的是满足电子产品的高密度封装、多功能化、小型化和高可靠性等。从而赢得客户的信赖及抢占更多的市场份额。
HDI circuit boards are widely used in smart phones, medical electronics, automotive electronics and other many fields. With the end users put more and more requirements to electronic products, and with the application of HDI in new fields gradually, it has put forward higher and higher requirements for HDI technology, equipment and HDI printed circuit boards. HDI printed circuit has more and higher requirements for high frequency, high speed, ultrathin and stability of materials. The purpose is to meet the high density packaging, multi-function, miniaturization and high reliability of electronic products, so as to win customers trust and seize more market share.
出处
《印制电路信息》
2018年第A02期461-467,共7页
Printed Circuit Information
关键词
板材
多功能化
可靠性
高频高速
超薄化
稳定性
Laminate Material
Multi-functional
Reliability
High Frequency And High Speed
Ultrathin
Stability
