摘要
随着通信产业的发展，电子设备的信号传输及处理趋向于高频化和高速化，这要求挠性覆铜板（FCCL）材料具有低介电常数以及低介质损耗因子。文章论述了目前高频高速挠性电路板所用的胶黏剂，着重分析了各类型胶黏剂的材料组成、介电性能以及所存在的不足。
With the development of the communication industry, the signal transmission and processing of electronic equipment tend to be high frequency and high-speed. This requires flexible copper clad laminate （FCCL） materials with low dielectric constant and low dielectric loss factor. In this paper, the adhesives used for high-frequency and high-speed flexible circuit board are discussed. The material composition, dielectric properties and shortcomings of different kinds of adhesives are emphatically analyzed.
出处
《印制电路信息》
2018年第A02期468-472,共5页
Printed Circuit Information
关键词
高频
高速
挠性覆铜板
胶黏剂
介电常数
损耗因子
High Frequency
High-speed
Flexible Copper Clad Laminate （Fccl）
Adhesive
Dielectric Constant
Dissipation Factor
