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聚酰亚胺薄膜旋涂工艺及其抗电击穿性能 被引量:2

Process of spin-coating of polyimide thin-film and its characteristics of resistance to electric breakdown
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摘要 采用旋涂法制备了高质量的聚酰亚胺薄膜,研究了薄膜厚度与旋涂转速之间的关系;对不同厚度的旋涂薄膜进行了电击穿实验,探讨了膜厚对击穿性能的影响。结果表明:聚酰亚胺薄膜的厚度与旋转速度平方根的倒数(ω^(-1/2))呈线性正相关,通过控制转速可获得不同膜厚;薄膜越厚,击穿电压越高,但其平均击穿强度越低。在280℃的亚胺化条件下,旋涂薄膜的最高击穿电压为2 370 V,最大击穿场强为286. 33 k V/mm,可满足大多数微系统对绝缘性能的要求。 High-quality polyimide thin-film is fabricated by spin-coating,and the relationship between film thickness and rotation speed is studied. Electric breakdown test is carried out on the prepared thin-film with different thickness,and effects of the film thickness on electric breakdown property are studied. Results indicate that there is a linear positive correlation between the film thickness and reciprocal square root( RSR) ω-1/2 of rotation speed. By controlling rotation speed,different film thickness can be obtained,the thicker the film is,the higher the breakdown voltage,but lower average breakdown strength will be obtained. The maximum breakdown voltage and breakdown strength of the prepared polyimide thin film imidized at 280 ℃ are 2 370 V and286. 33 k V/mm,respectively. This means that the polyimide thin film fabricated by spin-coating can meet the insulation requirements of a wide variety of micro-electro-mechanical system( MEMS) devices.
作者 梁军生 杨金鹤 张小辉 胡亚明 王大志 LIANG Jun-sheng;YANG Jin-he;ZHANG Xiao-hui;HU Ya-ming;WANG Da-zhi(Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of Education,Dalian University of Technology,Dalian 116024,China;Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian 116024,China)
出处 《传感器与微系统》 CSCD 2019年第4期4-7,共4页 Transducer and Microsystem Technologies
基金 国家自然科学基金资助项目(51675085 51475081)
关键词 聚酰亚胺 薄膜 旋涂 电击穿 polyimide(PI) thin-film spinning-coating electric breakdown
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