期刊文献+

入口节流微通道换热器内相变传热特性 被引量:4

Heat transfer characteristics of microchannel heat exchanger with inlet orfice
原文传递
导出
摘要 设计加工一种带有入口节流结构的铜基微通道换热器,理论分析其传热模型、实验测量微通道换热器内相变换热的传热特性和压力特性。结果表明:换热器内部的热传递过程为其主要换热模式;换热器表面温度随加热热流密度的增大而增大;微通道入口流速对表面温度影响较小;入口工质过冷度线性影响换热器的表面温度。热流密度在不同阶段对换热系数有不同影响,热流密度为360 W/cm^2时,换热器换热系数出现最大值;换热器压降随热流密度和系统流速的增加而增大。 A microchannel heat exchanger with inlet orfice and copper was designed,manufactured and studied.Its heat transfer model was theoretically analyzed.The heat transfer characteristics and pressure drop under the phase transition condition in the microchannel heat exchanger were measured experimentally.The results show that the heat transfer process in the micro-channel heat exchanger can be divided into two different stages.The surface temperature of heat exchanger increases with increasing of the heat flux.The inlet velocity of microchannel has little effect on the surface temperature.The surface temperature of the heat exchanger is linearly influenced by the overcooling degree of working medium at the inlet.The dry degree of the outlet and the heat flux have different effects on the heat transfer coefficient at different stages.The maximum value of heat exchanger coefficient appears when the heat flux is 360 W/cm^2.The pressure drop of heat exchanger increases withr rising of heat flux and inlet velocity of microchannel.
作者 袁俊飞 王林 王占伟 张敏慧 Yuan Junfei;Wang Lin;Wang Zhanwei;Zhang Minhui(Institute of Refrigeration,Heat pump and Air conditioning,Henan University of Science and Technology,Luoyang 471023,China)
出处 《低温与超导》 CAS 北大核心 2019年第8期59-64,共6页 Cryogenics and Superconductivity
基金 国家自然科学基金项目(U1504524,51876055)
关键词 入口节流 微通道 相变换热 表面温度 压降 Inlet orfice Microchannel Phase transformation Surface temperature Pressure drop
  • 相关文献

参考文献4

二级参考文献21

  • 1钱吉裕,平丽浩,陈陶菲,徐德好,宣益民.一种新型阵列射流冲击冷板的实验研究[J].工程热物理学报,2008,29(8):1357-1359. 被引量:4
  • 2李腾,刘静.芯片冷却技术的最新研究进展及其评价[J].制冷学报,2004,25(3):22-32. 被引量:66
  • 3边绍雄,等.低温制冷机[M].北京:机械工业出版社,1991.
  • 4E.I.米库林,等.微型金属片式J-T低温制冷器[M].莫斯科:莫斯科国立技术大学,1995.
  • 5陶文铨.数值传热学[M].西安:西安交通大学出版社:第2版,2004.
  • 6Little W A, Paugh R L. Cooling technologies for thermal management and enhanced high speed operation of CMOS microprocessors and memory chip[ C ]. Proceeding of ASM International's 3rd Electronics Materials and Processing Congress, San Francisco, USA, 1990.
  • 7Kim J. Spray Cooling Heat Transfer: The State of TheArt[ J]. International Journal of Heat and Fluid Flow,2007,28(4) :753 -767.
  • 8Bar C A, Arik M. Ohadi M. Direct Liquid Cooling ofHigh Flux Micro and Nano Electronic Components [ J ].Proceedings of the IEEE, 2006.
  • 9Kim Jungho. Spray Cooling Heat Transfer:The State ofThe Art [ J ]. International Journal of Heat and FluidFlow, 2007,28(4) :753 -767.
  • 10刘一兵,黄新民,刘安宁,肖宏志.基于电子散热新技术的研究[J].低温与超导,2008,36(3):54-57. 被引量:14

共引文献44

同被引文献57

引证文献4

二级引证文献11

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部