摘要
无源温度补偿衰减器主要用于稳定射频微波放大器的增益随温度的变化。本文对该类器件的原理、设计、制作、应用及发展趋势等各方面做了系统的介绍。相对于其他补偿方案,使用此类器件具有设计简单、成本低、性能优异等特点。无源温补衰减器的核心设计在于选取正温度系数(PTC)和负温度系数(NTC)热敏电阻的阻值及其温度系数,以使衰减量随温度接近线性变化而保持特征阻抗基本不变。目前,此类器件主要采用厚膜工艺制作,其关键材料为系列化的热敏电阻浆料。薄膜化是器件未来发展的重要方向,而其中NTC热敏电阻的薄膜化仍面临重大的技术挑战,需要解决材料性能及其系列化等难题。
Passive temperature compensation attenuators are mainly utilized for the thermal stabilization of RF/microwave amplifier gain.In this paper,the principle,design,fabrication,application and future trend of this type of device are introduced.In comparison with other compensation methods,using this type of component is simple,cost-efficient and of excellent performance.The core design of temperature compensation attenuator is to determine the resistances and temperature characteristics of the NTC and PTC thermistors,so that the attenuation varies almost linearly with temperature while the characteristic impedance maintains essentially constant.Up to present,this type of component has been mainly fabricated by thick film process with serialized thermistor pastes as the key materials.The adoption of thin film process will be the important direction for future development,but the fabrication of the thin film NTC thermistor is still confronted with some demanding challenges,mainly in obtaining proper electrical performance of the material and its serialization.
作者
廖进福
凌志远
沓世我
付振晓
LIAO Jinfu;LING Zhiyuan;TA Shiwo;FU Zhenxiao(State Key Laboratory of Advanced Materials and Electronic Components, Guangdong Fenghua Advanced Technology Holding Co., Ltd, Zhaoqing 526020, Guangdong Province, China;Department of Electronic Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China)
出处
《电子元件与材料》
CAS
CSCD
2017年第8期9-18,共10页
Electronic Components And Materials
关键词
温度补偿
衰减量
温度系数
热敏电阻
厚膜工艺
薄膜化
temperature compensation
attenuation
temperature coefficient
thermistor
thick film process
thin film process
