摘要
考察了薄膜电路制备过程中微氰预镀金、酸性硫酸盐光亮镀铜、氨基磺酸盐镀镍和微氰镀金后的微带线厚宽比,发现镀镍后的厚宽比最小,因此镀镍是影响线条精度的主要因素。研究了镀镍工艺条件对微带线厚宽比的影响,确定了最佳的电流密度、温度和pH分别为1.5 A/dm^2、55°C和4.0。与采用高低自由波、直流及单向脉冲波形时相比,单相全波整流波形下镀镍所得微带线具有最大的厚宽比。
The thickness-to-width ratio of microstrip after micro-cyanide gold pre-electroplating,acid sulfate copper electroplating,sulfamate nickel electroplating and micro-cyanide gold electroplating during the fabrication of thin film circuit was examined.Nickel electroplating is found to be the most important factor affecting the accuracy of microstrip due to the fact that the nickel-electroplated microstrip has the smallest thickness-to-width ratio.The effects of nick elelectroplating conditions on the thickness-to-width ratio of microstrip were studied.The optimal current density,temperature,and pH were determined to be1.5A/dm2,55°C,and4.0,respectively.The thickness-to-width ratio of the microstrip electroplated with nickel under a single-phase full-wave rectification waveform is higher than that obtained under high-to-low,constant direct,or unidirectional pulse waveform.
作者
孙林
谢新根
程凯
刘玉根
SUN Lin;XIE Xin-gen;CHENG Kai;LIU Yu-gen(The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 210016, China)
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第4期165-167,共3页
Electroplating & Finishing
关键词
薄膜电路
微带线
厚宽比
氨基磺酸盐镀镍
电流波形
thin film circuit
microstrip
thickness-to-width ratio
sulfamate nickel electroplating
current waveform
