摘要
介绍了一种ka频段片式一体化发射组件的研制方法和关键技术;为满足一体化片式组件小型化且工作频率高的要求,提出了一种集成天线辐射单元与射频模块三维垂直互联的方法,同时结合多功能芯片(MFC)技术、多芯片组装(MCM)技术实现组件高密度集成;研制的一体化组件尺寸为48mm×48mm×6.3mm、质量不超过100g,集成16个发射通道,每个通道包含6位数控移相器和5位数控衰减器;该组件集成度高、较传统组件在尺寸和重量上具有较大的优势。
dule are given.In order to meet the requirements of small size,high operation frequency,a new method of vertical interconnection technology is proposed,and the multi-functional chip(MFC)technique and multi-chip module(MCM)technique are also adopted to increase the integration level.Finally,a tile-type transmit module with 16 transmit channels has been developed successfully.The tile-type module features high integration level,has more advantages on the size and weight than the conventional module.
作者
石海然
张橹
倪子楠
薛欣
刘亚峰
Shi Hairan;Zhang Lu;Ni Zinan;Xue Xin;Liu Yafeng(Beijing Institute of Spacecraft System Engineering,Beijing 100094,China)
出处
《计算机测量与控制》
2018年第4期160-163,共4页
Computer Measurement &Control
关键词
一体化发射组件
垂直互联
片式
高密度装配
integrated transmit module
vertical interconnection
tile-type
high density assembly
