摘要
为了制备相对较低固化温度银导电复合材料,采用AgNO_3为银源,液相还原法制备了球形超细银粉。导电复合材料主要由超细银粉和有机载体组成,并系统研究了制备工艺对银导电复合材料性能的影响。结合X射线衍射(XRD)、透射电镜(TEM)、扫描电镜(SEM)、热分析(DSC/TG)等分析手段,研究了银粉的晶体结构、形貌及导电复合材料的电性能、强度和形貌。结果表明,球形超细银粉的平均粒径为150 nm,粒径分布在50~200 nm,呈立方晶体结构。推荐最佳的导电复合材料制备薄膜工艺为:70%银粉、30%的有机载体,在150℃的温度下固化30 min,该薄膜的电阻率为5.2×10^(-4)?·cm。
Spherical ultrafine silver powders were prepared by liquid phase reduction using AgNO3 to prepare silver isotropic electrical conductive adhesives with lower curing temperature.Conductive polymer composites composed of Ag powder and organic substrates were prepared,and effects of preparation processes on their properties were systematically studied.Properties including crystal structure,microstructure,phase components of silver powders,electrical conductivity,strength and morphology of the conductive composites were analyzed by XRD,TEM,SEM and DSC/TG.The results indicate that the ultrafine silver powder has a cubic crystal structure,and the average particle size of the ultrafine silver powder is 150 nm.The size distribution of the spherical shape powders ranges from 50 to 200 nm.The optimum curing processing conditions are temperature=150℃,holding time=30 min,silver powder concentration=70%and organic substrate concentration=30%,and the sheet resistance of the film sample is 5.2×10-4Ω·cm when prepared under such conditions.
作者
张小敏
赵国
李起龙
王斌
周英龙
ZHANG Xiao-min;ZHAO Guo;LI Qi-long;WANG Bin;ZHOU Ying-long(College of Materials Engineering,Jinling Institute of Technology,Nanjing 211169,China;Nanjing Wasin Fujikura Optical Communication Co.,Nanjing 210038,China;Nanjing Changhong General Equipment Manufacturing Co.,Nanjing 210000,China)
出处
《高校化学工程学报》
EI
CAS
CSCD
北大核心
2018年第2期421-426,共6页
Journal of Chemical Engineering of Chinese Universities
基金
金陵科技学院博士启动金(JIT-B-201601)
金陵科技学院创客项目-"复材梦之翼"(2017ck007)
关键词
超细银粉
液相还原法
导电复合材料
导电胶
导电性
强度
性能
ultrafine silver powder
liquid phase reduction method
conductive composites
electrical conductive adhesives
electrical conductivity
strength
properties
