摘要
以木屑为基质、真菌菌丝为粘结物质,采用无胶胶合方法制备菌丝-木屑生物质复合材料;参照GB/T17657—2013《人造板及饰面人造板理化性能试验方法》,测试菌丝-木屑生物质复合材料的抗拉强度、静曲强度、内结合强度;采用扫描电子显微镜(SEM)、傅里叶变换红外光谱(FTIR),分析菌丝-木屑生物质复合材料的微观结构、主要化学成分及材料成型机理。结果表明:制备的菌丝-木屑生物质复合材料,是一种新型可降解木质复合材料;灵芝菌丝-木屑材料、木耳菌丝-木屑材料的密度,分别在为0.64~0.70、0.68~0.78 g/cm^3之间;FTIR分析显示,两种菌丝对纤维素、半纤维素、木质素均有一定的降解,灵芝菌丝对木质素的降解程度略大于木耳菌丝;SEM观察显示,以三维网状结构存在于木屑表面及孔隙中,将散碎的木屑有效的粘结成为整体;力学性能测试显示,菌丝的生长情况对材料的力学强度有一定的影响,但是菌丝-木屑生物质复合材料力学性能仅为中密度纤维板的1/4。
Fungal hyphae/wood particle composites were prepared by using fungal hyphae and hardwood particle without glue.The tensile strength,modulus of rupture,internal bonding strength of the composite were tested by the National Standard GB/T 17657-2013.The micro-morphology,main chemical functional groups and forming mechanism of composites were observed by Scanning Electron Microscope(SEM)and Fourier Transform Infrared Spectroscopy(FTIR),respectively.The results showed that fungal hyphae/wood particle composite is a new biodegradable wood composite.The density of hyphae of G.lucidum/wood particle composite and agaric mycelium/wood particle composite are between 0.64-0.70 and 0.68-0.78 g/cm 3,respectively.FTIR results showed that both two kind of hyphaes can cause the degradation on celloluse,hemicelloluse and lignin.The degradation degree by hyphae of G.lucidum is bigger than that by agaric mycelium.The SEM results showed that two kind of hyphaes ran through the surface and gaps of wood particles in three-dimensional structure to make the wood particles connect solidly.The strength results showed that the growth of hyphae has some effects on the strength properties.The properties of two kinds of fungal hyphae/wood particle composites are only 1/4 compared with medium density fiberboard.
作者
夏慧敏
张显权
Xia Huimin;Zhang Xianquan(Northeast Forestry University,Harbin 150040,P.R.China)
出处
《东北林业大学学报》
CAS
CSCD
北大核心
2018年第4期63-66,共4页
Journal of Northeast Forestry University
关键词
真菌菌丝
木屑
复合材料
物理力学性能
Fungal mycelium
Wood particle
Composites materials
Mechanical properties
