摘要
为了避免低温共烧陶瓷(LTCC)基板在温度载荷环境下因热应力较大产生裂纹导致电路失效,对LTCC基板进行热应力仿真与结构优化分析。首先对LTCC基板进行温度载荷下的热应力分析,了解LTCC基板的应力分布;其次以LTCC基板应力较大位置的结构特征尺寸为设计变量,以应力大小为目标函数,建立优化的数学模型;最后综合采用响应面分析法和多目标遗传算法,寻找到LTCC基板应力分布的Pareto最优解。
In order to avoid the circuit failure caused by the thermal stress cracks when LTCC substrate suffered temperature load,thermal stress simulation and structural optimization design for the LTCC substrate were performed.The thermal stress simulation of LTCC substrate under the temperature load was performed to observe the stress distribution of LTCC substrate.Several structural feature sizes having obvious effect on stress of the LTCC substrate were assigned as the design variables,and some larger stresses were chosen as the optimal multi-objective functions,furtherly an optimal mathematical model was established.A set of Pareto optimal solutions of the LTCC substrate were obtained by using response surface analysis and multi-objective genetic algorithm.
作者
邓超
田文科
王天石
刘洋志
仇原鹰
DENG Chao;TIAN Wenke;WANG Tianshi;LIU Yangzhi;QIU Yuanying(The 29th Research Institute,China Electrorics Technology Corporation,Chengdu 610036,China;School of Electromechanical Engineering,Xidian University,Xi’an 710071,China)
出处
《电子元件与材料》
CAS
CSCD
北大核心
2018年第8期82-86,共5页
Electronic Components And Materials
基金
国防科工局技术基础科研资助项目(JSZL2015210B007)
关键词
LTCC基板
热应力分析
结构特征尺寸
响应面分析法
多目标遗传算法
PARETO最优解
LTCC substrate
thermal stress analysis
structural feature size
response surface analysis
multi-objective genetic algorithm
Pareto optimal solution
